PCB copper plating is a process where copper cations are driven by applied electric field and being reduced at the cathode surface. It’s a metal electrodeposition process that cooperate with liquid phase mass transfer, electrochemical reactions and electrocrystallization. Electroplating system consists of a DC power source, a dimensionally stable anode (DSA), electrolyte and PCB plate that is going to be plated (cathode).
Anodes：2H2O→O2↑ + (4H+) + 4e-
Cathode：Cu2+ + 2e-→Cu
YUXI anodes are offered in standard and custom designs to ensure optimum performance: